HILLSBORO, OREGON (USA) – September 16, 2014 – TriQuint Semiconductor, Inc. (NASDAQ: TQNT), a leading RF solutions supplier and technology innovator, today announced its TQP9059, a versatile multi-mode, multi-band power amplifier (MMPA) module with envelope tracking, earned an award in the Outstanding RF/Wireless/Microwave Products of the Year category at the 2014 China Annual Creativity in Electronics (ACE) Awards.
The highly integrated module not only prolongs battery life with new envelope tracking technology, but also simplifies complex RF design for multi-band smartphones with a new mobile chip interface used by multiple chipset partners. It is designed on TriQuint's GaAs HBT technology with CuFlip® assembly offering state-of-the-art reliability, temperature stability and ruggedness. Its RF performance meets the stringent linearity, noise and harmonics requirements for multi-mode operation while simultaneously offering a system current consumption lower by 50mA than the nearest competitor, thus improving battery life.
TriQuint - Reach Further, Reach Faster™ - TriQuint's TQP9059 MMPA Secures 2014 China ACE Award
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