Brocade Wins Best of Show Grand Prize Award for SDI/NFV at Interop Tokyo 2016 (NASDAQ:BRCD)

Brocade Wins Best of Show Grand Prize Award for SDI/NFV at Interop Tokyo 2016 (NASDAQ:BRCD)

Broadcom Announces First Dual ISDB-T Chipset for Digital Terrestrial TV in Latin America

Press release:

Broadcom Announces First Dual ISDB-T Chipset for Digital Terrestrial TV in Latin America

Innovation Opens the Way for Hybrid TV Services in Brazil

SAO PAULO, July 30, 2012 /PRNewswire/ -- ABTA

News Highlights:

• Broadcom's Digital Terrestrial TV chipset offers a new level of integration to burgeoning ISDB-T markets in Latin America; DTT households in Latin America are expected to grow 400% by 2017*.
• Hybrid TV services offer linear and advanced TV content and services when interfaced with a range of Broadcom set-top box system-on-a-chip (SoC) platforms.

Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the BCM3472, the industry's first fully integrated 40nm Dual ISDB-T receiver chipset.  Addressing the growing popularity of digital TV in Latin America, Broadcom is driving the deployment of digital terrestrial TV (DTT) services in Brazil and a range of emerging markets around the world.  For more news from Broadcom, visit ourNewsroom.

The new chip can be combined with Broadcom set-top box SoCs to launch Hybrid TV — digital terrestrial broadcast combined with advanced pay TV services.  This enables operators to offer subscribers linear TV while adding new, advanced services like Digital Video Recorder (DVR) and Video on Demand (VoD). By supporting Dual ISDB-T Receivers, Broadcom's solution is ideal for Hybrid STB and DVR solutions where multiple tuners must be included in the platform. The BCM3472's 12mm x 12mm package enables device manufacturers to save space and cost over existing solutions.

Additional Product Features

• Integrates two receivers that include low-noise amplifiers (LNAs) with a tuner and demodulator on a single-chip that enables better cost and design efficiencies.
  • RF loop through, daisy chain and clock sharing that eliminates the need for multiple crystals in a multi-tuner design.
• Broadcom's BCM3471 40nm Single ISDB-T device features an LNA, tuner and demodulator on a single-chip.

Availability

Broadcom's BCM3472 and BCM3471 chips are currently sampling and will be shipping in mass production at the end of Q1 2013.

For ongoing Broadcom news visit our Newsroom, read our B-Connected Blog, or visit us on Facebook or Twitter. And to stay connected, subscribe to our RSS Feed.

Quotes

Sam Rosen, Senior Analyst, ABI Research:

"Latin American countries are currently in the early implementation of their transition to digital terrestrial platforms, withBrazil leading the region.  With this transition, we expect DTT households using the ISDB-T standard in Latin America to grow 400% between 2012 and 2017, to 17.5 million households.  Many operators will launch Hybrid TV services, which leverage DTT for live, linear broadcasts while using satellite or IP networks to deliver advanced services, including VoD."

Dan Marotta, Broadcom's Executive Vice President and General Manager, Broadband Communications Group:

"The BCM3472 supports the huge growth in pay TV households projected in Latin America in the next several years. Broadcom's ability to reach new levels of integration with the BCM3472 enables our customers to save space and cost, supporting the transition to Hybrid TV services.  Now operators can cost-effectively deploy Hybrid TV solutions supporting pay TV and other services while also supporting existing digital terrestrial broadcasts."

Contacts

Press Dana Brzozkiewicz Manager, Public Relations 949-926-6367 danabrz@broadcom.com

Investors Chris Zegarelli Senior Director, Investor Relations 949-926-7567 czegarel@broadcom.com

About Broadcom

Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments.  With the industry's broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by Connecting everything®. For more information, go to www.broadcom.com.

Broadcom to Present at Upcoming Conferences

Press release:

Broadcom to Present at Upcoming Conferences

IRVINE, Calif., July 25, 2012 /PRNewswire/ -- Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductors for wired and wireless communications, will be presenting at the following third quarter 2012 conferences:

• 15th Annual Oppenheimer Technology, Internet & Communications Conference on Tuesday, August 14, 2012.Broadcom's presentation begins at 8:15 a.m. ET at the Four Seasons Hotel in Boston.
• Citi 2012 Technology Conference on Wednesday, September 5, 2012. Broadcom's presentation begins at 12 p.m. ET at the Hilton New York Hotel in New York.
• Deutsche Bank Securities dbAccess 2012 Technology Conference on Thursday, September 13, 2012. Broadcom's presentation begins at 10:20 a.m. PT at the Encore Wynn Hotel in Las Vegas.

The company's presentations, which may include information regarding current and future products and technologies, end market trends and the company's current financial prospects, will be available to the public via audio webcast.

To listen to these webcasts, or to view any financial or other statistical information required by SEC Regulation G, please visit the Investors section of Broadcom's website at www.broadcom.com/investors. A replay of each webcast will be made available within 24 hours of the presentation, and will be accessible for two weeks thereafter.

For ongoing news, visit Broadcom's Newsroom, read the B-Connected Blog, or visit Facebook or Twitter. And to stay connected, subscribe to Broadcom's RSS Feed.

About Broadcom

Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With the industry's broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by Connecting everything®. For more information, go to www.broadcom.com.

Broadcom and Emulex Reach Partial Settlement and Worldwide Patent Agreement

Press release:

Broadcom and Emulex Reach Partial Settlement and Worldwide Patent Agreement

Emulex Agrees to Pay Broadcom a Release and License Fee

IRVINE, Calif., July 5, 2012 /PRNewswire/ -- Broadcom Corporation (NASDAQ:BRCM) and Emulex Corporation(NYSE:ELX) today announced that the companies have entered into a partial settlement and worldwide patent license agreement relating to the patent litigation in the U.S. Federal District Court in Santa Ana, California.  The agreement will result in the dismissal of certain of Broadcom's infringement claims against Emulex.  Emulex also receives a license to Broadcom U.S. Patents Nos. 7,471,691; 7,058,150; 6,424,194 and related families for certain fields of use including Fibre Channel applications.  The fields of use licensed to Emulex are related, in part, to the Emulex XE201 (Lancer) ASICs, that are capable of Fibre Channel and Ethernet, 16Gbps Fiber Channel HBAs, Fibre Channel SOCs and other FC products.  Emulexwill pay to Broadcom a release and license fee of $58 million in cash.

Additional terms of the agreement include, among other elements:

• Emulex agreed to provide certain rights to Broadcom protecting Broadcom from Emulex patent assertions; and
• The Emulex products are licensed to Emulex for the permitted fields of use, and are licensed to be purchased byEmulex's customers worldwide, and are licensed to be made for Emulex by Emulex's suppliers.

The remainder of the existing litigation between the parties regarding certain of Broadcom's U.S. Patents was not dismissed.  Other terms of the agreement are confidential.

About Broadcom

Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With the industry's broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by Connecting everything®. For more information, go to www.broadcom.com.

About Emulex

Emulex, the leader in converged networking solutions, provides enterprise-class connectivity for servers, networks and storage devices within the data center. The company's product portfolio of Fibre Channel host bus adapters, 10Gb Ethernet network interface cards, Ethernet-based converged network adapters, controllers, embedded bridges and switches, and connectivity management software are proven, tested and trusted by the world's largest and most demanding IT environments. Emulex solutions are used and offered by the industry's leading server and storage OEMs, including Cisco, Dell, EMC, Fujitsu, Hitachi, Hitachi Data Systems, HP, Huawei, IBM, NEC, NetApp and Oracle. Emulex is headquartered inCosta Mesa, Calif., and has offices and research facilities in North America, Asia and Europe. More information aboutEmulex (NYSE:ELX) is available at www.Emulex.com.

Broadcom Announces Conference Call to Review Second Quarter 2012 Financial Results

Press release from Broadcom:

http://www.broadcom.com/press/release.php?id=s688667

Broadcom's 5G WiFi Chip Family Wins R&D 100 Award

Press release:

Broadcom's 5G WiFi Chip Family Wins R&D 100 Award

5G WiFi Recognized by R&D Magazine as One of the "Most Technologically Significant Products" of the Year

IRVINE, Calif., June 22, 2012 /PRNewswire/ -- Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced that its family of 5G WiFi chips (based on the IEEE 802.11ac standard) won a prestigious R&D 100 Award. Selected by an independent judging panel and the editors of R&D Magazine, the R&D 100 Awards represent the 100 most technologically significant products of the past year. For more news, visit Broadcom's Newsroom.

Broadcom's new 5G WiFi SoCs, introduced in January 2012 at CES, are designed to address the increased reliance on wireless networks and growing demand for more reliable connectivity. 5G WiFi is three times faster and up to six times more power efficient than previous generations of Wi-Fi. Products powered by 5G WiFi provide broader coverage and allow consumers to experience faster video streaming and connect multiple devices simultaneously all while extending battery life. For more information, please visit www.5GWiFi.org.

Over the past 50 years, the R&D 100 Awards have honored some of the most revolutionary technologies newly introduced to the market across industry sectors as diverse as telecommunications, high-energy physics, software, manufacturing, and biotechnology. The winners represent a cross-section of industry, academia, private research firms, and government labs.

"5G WiFi is the most significant wireless innovation of the year. Broadcom recognized the importance of the 802.11ac standard early, invested accordingly and committed to driving adoption across the entire ecosystem. The flawless execution speaks to Broadcom's engineering excellence and quality and talent of the team devoted to this effort. To be recognized by an awards program with such a tremendous history and track record of identifying real innovation and excellence is a true honor." Michael Hurlston, Sr. Vice President & General Manager, Wireless Connectivity Combo Group

About Broadcom

Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments.  With the industry's broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by connecting everything®. For more information, go to www.broadcom.com.

Broadcom®, the pulse logo, Connecting everything®, and the Connecting everything logo are among the trademarks ofBroadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU.  Any other trademarks or trade names mentioned are the property of their respective owners.

Broadcom Accelerates Wi-Fi Adoption with Next Generation Combo Chip and Wi-Fi Display Dongle

Press release:

Broadcom Accelerates Wi-Fi Adoption with Next Generation Combo Chip and Wi-Fi Display Dongle

New Wireless Innovations Extend Wi-Fi Media Experience to Broader Range of CE Devices

IRVINE, Calif., June 20, 2012 /PRNewswire/ --

News Highlights:

• Broadcom wireless innovations enable Wi-Fi as the connectivity backbone for in-home media distribution
• New CE combo chip provides high bandwidth Wi-Fi for high quality video streaming and Bluetooth 4.0 for voice commands and gestural remotes
• Wireless media dongle design brings Wi-Fi Display to any HDTV for real-time streaming of video from mobile devices to the big screen

Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today unveiled two new solutions that will enable a consumer video experience that spans mobile devices, smart TVs and other consumer electronics (CE). The new products include Broadcom's first combo chip optimized to add dual-stream, dual-band Wi-Fi and Bluetooth 4.0 connectivity to CE devices and an integrated wireless dongle design that will bring Wi-Fi Display (now called Wi-Fi Miracast) to existing digital TVs and media boxes. For more news, visitBroadcom's Newsroom.

With wireless connectivity attach rates in smart TVs, set-top boxes, streaming media boxes and other products expected to grow to almost 50% over the next four years, Wi-Fi will increasingly become a primary channel by which video and other media reach the CE device. Similarly, smartphones and other mobile devices have become important platforms for viewing digital content and now occupy an important role in how people access and enjoy media.

Combo Chip Optimized for CE

The new Broadcom® BCM43242 features advanced dual-band multiple input, multiple output (MIMO) Wi-Fi technology to enable integrated video streaming and over-the-top capabilities in CE devices. The BCM43242 also includes dual-stream technology, supporting features such as advanced error correction and an innovative capability to support simultaneous Wi-Fi connections to two devices, allowing a smart TV to simultaneously access Internet content and stream high-bandwidth video from a smartphone, tablet or PC.  The chip can also enable peer-to-peer transmissions in the 5 GHz band, with more spectrum and less congestion in that frequency range allowing better quality video streaming and smartphone-to-TV video sharing.

With integrated Bluetooth 4.0, the new combo device will enable CE products to use advanced remotes, game controllers, stereo headphones, keyboards, 3D glasses and other interface devices. Broadcom Bluetooth also features the ability to stream audio to home stereos, enable voice recognition in remote controls and connect smartphones and other devices to the CE ecosystem, driving innovation in user interface development. The BCM43242 includes Broadcom's best-in-class InConcert co-existence technology--with key optimizations for DTV use cases--that enables uninterrupted Bluetooth connectivity while maintaining high Wi-Fi throughput.

This level of integration enables a complete, cost effective wireless subsystem for digital TV platforms.

Wi-Fi Display Dongle

Broadcom's new wireless dongle design features the proven capabilities of the BCM43236 dual-band Wi-Fi chip and the low power, high performance BCM2835 VideoCore® media processor, enabling cost-effective adapter products that easily add Wi-Fi Display capabilities to existing CE devices with an HDMI port. The ability to conveniently use the larger screens of digital televisions for viewing content is driving adoption of Wi-Fi Display, which couples Wi-Fi and video encoding technology to allow the consumer to seamlessly move the mobile user interface from a small screen to a bigger display while maintaining control via the mobile's touch screen.

Broadcom's new dongle platform features its best-in-class Wi-Fi solutions, which have been designed to support zero packet loss, minimize latency for interactive use cases and mitigate interference while maximizing screen resolution and picture quality. These advantages make Broadcom Wi-Fi technology particularly well suited for Wi-Fi Display applications, where latency and packet loss can degrade the user experience. Broadcom's VideoCore processing technology enables vivid graphics and HD video playback with minimal power consumption.

Further driving adoption and use of Wi-Fi Display, Broadcom has integrated support for the technology into several of its key smartphone platforms, including its BCM28155 3G HSPA+ dual-core SoC. In addition, handsets based on Broadcomsmartphone platforms that include the BCM4334 smartphone combo chip will also be able to offer these media streaming capabilities. Wi-Fi Display support is also planned for all future Broadcom dual-core smartphone platforms.

BCM43242 Key Features:

• 802.11n 2x2 MIMO technology uses dual transmitters and receivers to boost data rates and enable 70% greater range at high-speed than single stream Wi-Fi.
• Advanced Virtual Simultaneous Dual Band (VSDB) functionality enables peer-to-peer and access point connectivity at the same time.
• First to combine MIMO Wi-Fi with Bluetooth 4.0 on a monolithic SoC for CE applications.
• Bluetooth 4.0 includes advanced software features to support low power peripherals and provide superior 3D glasses synchronization.
• Includes key interfaces for CE applications, including USB 2.0 and USB 1.1 for easier integration with existing DTV and CE platforms.
• Delivers proven Bluetooth / Wi-Fi coexistence features to CE devices for unparalleled user experience when the two technologies share the 2.4GHz band.
• Integrated RF power amplifiers (PAs) accommodating both the 2.4 GHz and 5 GHz frequency bands eliminate the need for external PAs, reducing bill of materials (BOM) cost.
• Other advanced features include antenna diversity, LDPC, STBC and "fast channel switch" that enables the use of two radio channels simultaneously. 

Wi-Fi Display Dongle Features:

• Ultra low-power dual-band, dual-stream media dongle solution with simplified connectivity.
• Compatible with Wi-Fi Display v1.40 or later compliant devices and compliance with Wi-Fi CERTIFIED Miracast, when available.
• Supports ultra low latency performance when Broadcom technology is used at both ends of the connection, defaulting to standards-compliant latency in mixed environments.
• Integrated USB 2.0 interface allows dongle to be self-powered by USB rather than an AC wall plug adapter, reducing cost and design complexity.
• Video processing supports 720p and 1080p HD video.
• Complete turnkey software solution and design files enable rapid time to market for end-user products.

Availability

The BCM43242 is now sampling to Broadcom's early access customers, with full production expected in Q4 2012.Broadcom's integrated Wi-Fi Display dongle design is also sampling to customers, with the BCM43236 Wi-Fi chip andBCM2835 media processor shipping in production quantities.

For ongoing news, visit Broadcom's Newsroom, read the B-Connected Blog, or visit Facebook or Twitter. And to stay connected, subscribe to Broadcom's RSS Feed.

Quotes:

Peter Cooney, Practice Director - Semiconductors, ABI Research

"Over the top video, wireless display applications, advanced remote controls and 3D glasses are some of the innovative applications that wireless connectivity is enabling in the living room, providing ever more opportunities for involving and engaging the end user. With its complete Wi-Fi Display dongle design, Broadcom will help drive use of this innovative technology today while its new combo device makes these capabilities more available in next-generation products."

Michael Hurlston, Sr. Vice President & General Manager, Wireless Connectivity Combo business unit

"The size, performance and time-to-market advantage that Broadcom combo chips provide have driven the dramatic growth of smartphones and the ubiquitous adoption of WiFi and Bluetooth connectivity worldwide. With the introduction of our new combo products optimized for the CE market, we are driving a similar revolution in the digital home and extending the connection to the mobile world.  Combined with our Wi-Fi Display dongle solution, Broadcom delivers an end-to-end portfolio that enables seamless sharing of video content to and from any platform."

About Broadcom

Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments.  With the industry's broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by connecting everything®.  For more information, go to www.broadcom.com.

Broadcom®, the pulse logo, Connecting everything®, VideoCore® and the Connecting everything logo are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU.  Any other trademarks or trade names mentioned are the property of their respective owners.

Broadcom Joins HP ProActive Insight Architecture Alliance

News release:

Broadcom Joins HP ProActive Insight Architecture Alliance

Commitment to Innovation and Quality Recognized

IRVINE, Calif., May 29, 2012 /PRNewswire/ -- Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced it is a founding member of the HP ProActive Insight Architecture (PIA) Alliance, selected by HP for its latest generation of 1GbE and 10GbE NetXtreme® controllers developed to the HP standards and interfaces that contribute to the industry-transforming performance and reliability of HP ProLiant Generation 8 (Gen8).

(Logo:  http://photos.prnewswire.com/prnh/20060609/BROADCOMLOGO )

HP ProActive Insight Architecture, now available in the new HP ProLiant Gen8 servers, transforms data center economics with built-in intelligence that improves performance and uptime, while lower operating costs. As a founding member of theHP PIA Alliance, Broadcom will continue to contribute to the elimination of common problems caused by human-to-technology interaction that lead to system downtime and data loss. Through embedded HP ProLiant Gen8 server technology, HP PIA Alliance members, along with HP, can evaluate data and other critical analytics to continually optimize and improve on business results.

The HP PIA Alliance brings together the collective value of the world's leading technology innovators to complement HP ProLiant Gen8 servers. Alliance members, drawn from leaders in memory, storage, I/O, power and infrastructure solutions, build technology components to HP Proactive Insight architecture standards and interfaces. These components help to analyze thousands of system parameters and automate processes that consume critical data center resources. Additionally, they provide insight into aspects of application performance and IT infrastructure optimization that had once been nearly impossible to capture and utilize.

Quotes:

"Rising demand for server virtualization, cloud computing, and I/O intensive applications are driving the need for greater processing and automation capabilities in the data center and enterprise networks," said Vinod Lakhani, General Manager, High Speed Controllers at Broadcom Corporation.  "We're honored to have a seat at the table in driving and defining next generation networking technology together with the expertise of industry leaders throughout the space."

"The cost of manual operations and system optimization needed to support growing IT requirements is unsustainable," said Jim Ganthier, vice president, Marketing and Operations, Industry Standard Servers and Software at HP. "The PIA Alliance brings together some of the world's leading technology companies to eliminate manual maintenance tasks and significantly improve data center efficiency."

Broadcom will use the HP PIA qualified insignia as visible assurance of meeting HP's stringent quality and performance standards. The HP PIA Alliance will be featured at HP's premier client event, HP Discover, which takes place June 4-7 in Las Vegas.

For ongoing news, visit Broadcom's Newsroom, read the B-Connected Blog, or visit Facebook or Twitter. And to stay connected, subscribe to Broadcom's RSS Feed.

Resources:

NetXtreme® Ethernet Solutions for HP

About Broadcom

Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With the industry's broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by Connecting everything®. For more information, go to www.broadcom.com.  

Broadcom Announces Industry's Lowest Power, Highest Performance 100GbE Multi-Rate Gearbox PHYs

Press release:

Broadcom Announces Industry's Lowest Power, Highest Performance 100GbE Multi-Rate Gearbox PHYs

Industry's First to Support 10GbE, 40GbE and 100GbE Line Interfaces for Next-Generation Data Center, Enterprise and Core Networks

IRVINE, Calif., May 2, 2012 /PRNewswire/ --

News Highlights:

• 40 nanometer (nm) CMOS PHY reduces power consumption by more than 35 percent(1)
• Exceeds performance of IEEE 802.3ba standard for 100GbE and ITU OTL 4.4 signaling
• Delivers 4-lane and 10-lane bi-directional transmission — increases flexibility for network managers

Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry's lowest power and highest performance multi-rate 100 Gigabit Ethernet (GbE) physical layer transceivers (PHYs) for next-generation data center, enterprise and core networks. The newBroadcom® BCM84790 and BCM84793 gearbox PHYs extend Broadcom's industry-leading portfolio of 10GbE, 40GbE and now 100GbE physical layer devices while offering the first multi-rate interface for 4-lane (4x25 Gbps) and 10-lane (10x10 Gbps) bi-directional transmissions. See the technology in action at INTEROP 2012 or visit www.broadcom.com to learn more.

The low power 40 nm CMOS architecture dissipates only 2.5 watts per port, delivering power savings of more than 35 percent as compared to previously available solutions. The BCM84790 features a space-saving 17x17mm BGA package specifically engineered to support CFP network applications. The BCM84793 features a 19x19mm BGA package with the ability to support 10-lane bi-directional transmissions at 10 Gbps each.  This added flexibility ensures support for future-generation networking formats such as CFP2 and CXP.

Optimized for IT professionals who design and manage high-bandwidth data center and enterprise networks, theBCM84790 and BCM84793 gearbox PHYs have the ability to multiplex and demultiplex data across four 25 Gbps channels to (or from) ten 10Gbps channels.  Both devices can also be configured to support four bi-directional lanes at 10Gbps for 40GbE repeater applications, support Ethernet and optical transport networking, and are compliant with the IEEE 802.3ba standard for 100GbE and ITU OTL 4.4 signaling.

Market Drivers:

• Consumer demand and traffic volume continues to rise for high-bandwidth applications(2)
• As the need for higher density processing and transmission of data rises, so does the need for data center, enterprise and core networks to expand from 10GbE and 40GbE to 100GbE(3)
• 100GbE gearbox PHYs a clear requirement for high density networks moving to higher bandwidths(3)
• 100GbE ports are expected to increase more than 50X from 2011 to 2016(4)

Key Features:

• Supports Ethernet and optical transport networking (OTN)
• 100GbE/OTN VSR28 to CAUI interface
• Less than 200 femtoseconds (fs) root mean square (rms) of random jitter on the 25Gbps transmit outputs
• High-speed eye monitoring diagnostics on all data I/O
• Integrated clean-up phase lock loop (PLL) reduces bill of material cost
• Single REFCLK (reference clock) input
• Low latency architecture

Availability

The BCM84790 and BCM84793 are sampling now.  Production release is scheduled for the second half of 2012.

For ongoing news, visit Broadcom's Newsroom, read the B-Connected Blog, or visit Facebook or Twitter. And to stay connected, subscribe to Broadcom's RSS Feed.

Quotes:

Jag Bolaria, Senior Analyst, The Linley Group

"Increasing Internet traffic and rising demand for high-bandwidth content are driving strong growth for 100GbE solutions in the enterprise and data center markets. The bi-directional transmission, low power consumption and space-saving design of Broadcom's new PHYs enable IT organizations to transform their networks and achieve higher performance."

Lorenzo Longo, Broadcom Vice President & General Manager, High Speed Interconnect Products

"Broadcom is committed to providing the broadest portfolio of 10GbE, 40GbE and now 100GbE PHYs in the industry.  Our new 100GbE gearbox PHYs achieve the industry's highest performance and lowest power consumption, a combination which is very difficult to achieve. These industry-leading PHYs also offer the unique advantage of enabling new 100G applications with backward-compatibility to existing 10GbE and 40GbE rates."

About Broadcom

Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments.  With the industry's broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by Connecting everything®. For more information, go to www.broadcom.com.

Broadcom®, the pulse logo, Connecting everything®, and the Connecting everything logo are among the trademarks ofBroadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU.  Any other trademarks or trade names mentioned are the property of their respective owners.

(1) As compared to competitive devices

(2) Cisco Virtual Networking Index, 2011 — 2016

(3) The Linley Group - A Guide to Ethernet Switch and PHY Chips, Eighth Edition

(4) Infonetics, February 2012