New Rugged Platform from GE Allows FACE™ Developers to Minimize Cost, Risk and Time-to-Market

Press release:

31 July 2012

New Rugged Platform from GE Allows FACE™ Developers to Minimize Cost, Risk and Time-to-Market

 

• FACEREF1 is a complete, ready-to-run hardware platform
• Provides optimal support for Wind River Systems, Presagis software
• High performance, high Technology Reference Level

HUNTSVILLE, AL July 31, 2012 GE Intelligent Platforms (NYSE: GE) announced the FACEREF1 Software Reference Platform today at the FACE™ Consortium Meeting (PEO Aviation, Huntsville, AL). The FACEREF1 platform is designed to allow organizations developing FACE-compliant applications to take advantage of a COTS (commercial off-the-shelf) solution that is pre-configured, pre-validated and pre-tested – reducing risk, cost and time-to-market. It provides a platform for customers to try COTS software, develop application code, and demonstrate capabilities on a rugged platform that is capable of being deployed on real airborne platforms.

The Future Airborne Capability Environment (FACE™) Consortium, an Open Group Managed Consortium, is leading the development of open standards for avionics systems. The Consortium is creating a technologically appropriate open FACE reference architecture, standards and business model that will ensure interoperability, increase portability, promote innovation and competition, bring advanced capabilities to the warfighter faster and lower implementation costs.

The FACE Consortium provides a vendor-neutral forum for industry and the U.S. government to work together to develop and consolidate the open standards, best practices, guidance documents and business models necessary to achieve these results.

GE is working closely with Wind River Systems and Presagis to ensure that the two companies’ software roadmaps for FACE-compliant operating system, OpenGL and HMI tools work “out of the box” on the FACEREF1 hardware platform.

“A key objective of the FACE initiative is to create an environment in which advanced, yet proven, computing technologies can be deployed to the warfighter faster and at lower cost,” said Rod Rice, General Manager, Military & Aerospace Products, GE Intelligent Platforms. “The FACEREF1 platform allows these objectives to be met by taking advantage of an off-the-shelf, high performance solution that features a high Technology Reference Level (TRL), that is ready to run, and that eliminates the time, risk and cost that would be incurred by developers creating a solution in-house.“

GE’s FACEREF1 Software Reference Platform is a complete, rugged subsystem that features GE’s SBC312 single board computer and PMCCG1graphics PMC. The SBC312 is based on Freescale™’s Power Architecture™ P4080 8-core processor yet has the power envelope of previous dual core systems, while the PMCCG1 features the high performance/low power S3 2300E GPU (graphics processing unit). The interface between the CPU and GPU is via a 4-lane PCI Express® to PCI-X® bridge, allowing high-bandwidth connectivity between the two processors.

For more information: http://defense.ge-ip.com/products/3687.

About GE

GE (NYSE: GE) works on things that matter. The best people and the best technologies taking on the toughest challenges. Finding solutions in energy, health and home, transportation and finance. Building, powering, moving and curing the world. Not just imagining. Doing. GE works. For more information, visit the company's website at www.ge.com.

A high res image can be found at:www.genewscenter.com/ImageLibrary/detail.asp?MediaDetailsID=4901

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GE Announces Rugged COM Express Module to Deliver High Performance and Reliability in Multi-Display Applications

Press release:

26 July 2012

GE Announces Rugged COM Express Module to Deliver High Performance and Reliability in Multi-Display Applications

 

• Features latest Intel® Core™ i7 dual- and quad-core processors
• Supports multiple simultaneous displays
• Ruggedization allows deployment in harshest environments

CHARLOTTESVILLE, VA July 26, 2012 GE Intelligent Platforms (NYSE: GE) today announced the latest addition to the company’s growing range of COM Express modules with the launch of its highest performance offering to date, the rugged bCOM6-L1400. Taking advantage of the significant processing and graphics capabilities of the recently-announced Intel® Core™ i7 processor, the bCOM6-L1400 can support multiple independent displays in a wide variety of commercial, industrial, transportation and defense applications in a broad range of embedded computing environments.

The launch of the bCOM6-L1400 further expands GE’s range of rugged COM Express solutions following a series of announcements. The most recent of these was the launch of the rugged bCOM6-L1200 – which features a range of five VIA Nano™ and VIA Eden™ processor options - in February.

By separating the carrier card from the processor, the COM Express architecture extends the useful life of the subsystem by allowing simple, cost-effective upgrade of the processor alone. This reduces long term cost of ownership while ensuring that performance keeps pace with changing needs.

Offered with a choice of either a dual-core or quad-core processor for maximum flexibility and enabling customers to select the optimum price-performance/watt combination for the planned application, the bCOM6-L1400 takes advantage of GE’s extensive experience and expertise in the design and development of rugged COM Express modules. It also complements GE Intelligent Platforms’ extensive portfolio of rugged embedded computingsolutions that includes single board computers, multiprocessors, Ethernet switches, displays and networking.

The bCOM6-L1400 can be confidently deployed in the harshest, most challenging environments that are subject to extremes of temperature, vibration, shock and contaminants. Its components are specifically selected for reliable operation in hostile environments, and the processor and memory are soldered to the board for the highest possible resistance to external forces.

Extended mechanical construction protects the module, which is designed for optional conformal coating for even greater resistance to moisture, dust, chemicals, and temperature extremes. Sophisticated dynamic thermal management optimizes uptime and helps prevent damage to the system.

GE is able to provide customers with the support necessary to enable them to develop their own carrier card configurations, or to provide custom carrier card variants on request. This ability provides significant flexibility to systems integrators looking to create unique, high value-added solutions.

“The bCOM6-L1400 is a further example of GE’s rugged high performance platform strategy in action, and of our commitment to bringing the most recent processor technologies to market as rapidly as possible,” said Steve Pavlovsky, Product General Manager, Control & Communication Systems, GE Intelligent Platforms. “The COM Express architecture is ideal for OEMs looking to reduce developments costs, minimize risk and time to market and to provide the lowest possible cost of ownership. With the announcement of GE’s bCOM6-L1400, those customers get not just the benefits of COM Express and of Intel’s latest processor, but also outstanding performance, exceptional flexibility, remarkable robustness – and the commitment to customer satisfaction for which GE is renowned.”

As well as its graphics capabilities (VGA, LVDS with dual channel support and SDVO/TMDS/DisplayPort over DDI), the bCOM6-L1400 features up to 8GBytes of DDR3 memory, Gigabit Ethernet and four SATA interfaces, with support for both RAID 0 and RAID 1. Also provided for optimum connectivity are eight USB 2.0 ports and four USB 3.0 ports.

About GE
GE (NYSE: GE) works on things that matter. The best people and the best technologies taking on the toughest challenges. Finding solutions in energy, health and home, transportation and finance. Building, powering, moving and curing the world. Not just imagining. Doing. GE works. For more information, visit the company's website at www.ge.com.

For more technical information: http://www.ge-ip.com/account/download/13246/3649

A high res image can be found at:www.genewscenter.com/ImageLibrary/detail.asp?MediaDetailsID=4877

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New Packet Processor from GE Delivers the Outstanding Performance Demanded by Communications Companies and the High Frequency Trading (HFT) Market

25 April 2012

New Packet Processor from GE Delivers the Outstanding Performance Demanded by Communications Companies and the High Frequency Trading (HFT) Market

 

• Innovative solution designed for communications equipment manufacturers, HFT applications and systems integrators features fastest Cavium OCTEON™ processor

• GE’s expertise, experience and customer support reduces cost and time-to-market
• Robust Product Lifecycle Management program provides long term lower cost of ownership

CHARLOTTESVILLE, VA — APRIL 25, 2012—Recognizing the need of a broad range of communications companies and telecommunicationsequipment manufacturers (TEMs) for the highest performance in packet processing, GE (NYSE: GE) today announced the WANic™ 66512 PCI Express® Packet Processor.

Designed for ease of development and deployment – resulting in reduced risk, faster time-to-market and faster time-to-revenue – and supported by GE’s renowned expertise and experience in fulfilling the requirements of Tier 1 TEMs, the WANic 66512 delivers exceptional performance and flexibility through its implementation of the fastest Cavium OCTEON® II processor, its PCI Express form factor, and the provision of board-level diagnostic tools and driver development kits.

The latest addition to the industry’s broadest range of PCI/PCI Expresspacket processors, and benefiting from GE’s extensive experience in their development, the WANic 66512 is distinguished by its use of Cavium’s 10-core 1.5GHz OCTEON™ II processor delivering very low latency and very high throughput to a broad range of applications, such as deep packet inspection, lawful intercept, secure access, network address translation, traffic management and session border control, as well as to high frequency trading applications.

“At GE Intelligent Platforms, we understand that every microsecond counts,” said Vibhoosh Gupta, Telecommunications Segment Leader, GE Intelligent Platforms. “Whether processing transactions on the trading floor or performing deep packet inspection for secure network access, the WANic 66512 Packet Processor is engineered to deliver the utmost performance. We also know that time-to-market is critical and therefore we complement the technical aspects of the WANic 66512 with world class expertise and a focus on exceptional customer service.”

The WANic 66512 benefits from GE’s extensive experience in providingextended support for the long term deployments that are typical of the telecommunications industry and a range of innovative programs designed to minimize cost of ownership by providing regular technology refresh opportunities as well as mitigating the effects of obsolescence.

It is designed for NEBS compliance and has been tested for interoperability, industry certification and regulatory compliance to ensure compatibility and rapid application deployment.

For more information: http://www.ge-ip.com/products/family/packet-processors
For data sheet: http://www.ge-ip.com/files/files/13174.pdf
A high resolution image to illustrate this release can be found at:www.genewscenter.com/imagelibrary/detail.asp?MediaDetailsID=4600

About GE

GE (NYSE: GE) works on things that matter. The best people and the best technologies taking on the toughest challenges. Finding solutions in energy, health and home, transportation and finance. Building, powering, moving and curing the world. Not just imagining. Doing. GE works. For more information, visit the company's website at www.ge.com.

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